One of the reasons why Gigabyte chose to omit any integrated fans in the I/O cover or chipset heat sink is noise. In fact, the company says this can lower the temperatures of PWM components on the motherboard's back by up to 10 per cent. A thin layer of what Gigabyte refers to as NanoCarbonВ is further coated on the base plate through electrostatic adhesion to improve thermal radiation. The back of the board also features an aluminum base plate that also acts as a heat sink for the rear of the PCB. Elsewhere, Gigabyte employs thicker Laird thermal pads, which boast improved thermal conductivity as well. Heat pipes also come into direct contact with the MOSFETs, which further helps with heat transfer. This fin array reportedly increases the surface area available for heat dissipation by 300%, compared to traditional heat sinks of the same size.

This effectively means that the entire motherboard is now a giant heatsink. While it may lackВ the integrated fan, it tries to make up for that with a multi-layered chipset heatsink that is connected by a heat pipe to the extensive heat sink fin array that cools the VRM. One surprising thing to note is that the X570 chipset is only passively cooled on this board, the lone exception in this shootout where everyone else has a fan built into the chipset heatsink. However, where the board really stands out is in the overclocking department, and the X570 Aorus XtremeВ features a true 16-phase power delivery subsystem to provide smoother and cleaner power to your Ryzen 3000 processor.Д«ut with overclocking comes plenty of heat, which is where Gigabyte's so-called Thermal Reactive ArmorВ comes in. Gigabyte's top X570 motherboard certainly looks the part, with beefy heatsinks, snaking heat pipes, and shielding for the majority of the PCB. Gigabyte X570 Aorus Xtreme Gigabyte X570 Aorus Xtreme

Msi vs gigabyte motherboard